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System-on-Chip Development Dead?
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Posted by: TotalRecall
EETimes reports:
SAN FRANCISCO — The system-on-chip movement is "dead," ambushed by the cost of additional mask layers needed to marry digital logic with memory and analog functions, Intel Corp. architecture manager Jay Heeb told the International Solid-State Circuits Conference on Tuesday (Feb. 11). Rather than SoCs, the chip industry will move instead to 3-D devices distantly related to today's stacked packages, he said.
Heeb, who manages Intel's Xscale processor core design effort in Chandler, Ariz., made his comments at an ISSCC session on the future of integrated circuits for 3G mobile phones. "The SoC is dead because of too many mask layers," he said. "We need to be bolting the optimum technologies together in what I call a So3D, a system-in-3D package. Then we can tune an application to a specific, optimum substrate."
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